THS4130, THS4131

HIGHSPEED, LOW NOISE, FULLY DIFFERENTIAL I/O AMPLIFIERS

SLOS318E − MAY 2000 − REVISED JANUARY 2004

23

POST OFFICE BOX 655303

PRINCIPLES OF OPERATION

general PowerPAD design considerations

The THS413x is available packaged in a thermally-enhanced DGN package, which is a member of the

PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is

mounted [see Figure 43(a) and Figure 43(b)]. This arrangement results in the lead frame being exposed as a

thermal pad on the underside of the package [see Figure 43(c)]. Because this thermal pad has direct thermal

contact with the die, excellent thermal performance can be achieved by providing a good thermal path away

from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of the

surface mount with the, heretofore, awkward mechanical methods of heatsinking.

More complete details of the PowerPAD installation process and thermal management techniques can be found

in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package (SLMA002). This document

can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also

be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE A: The thermal pad is electrically isolated from all terminals in the package.

Figure 43. Views of Thermally Enhanced DGN Package