TFP410

TI PanelBus DIGITAL TRANSMITTER

SLDS145A – OCTOBER 2001 – REVISED JANUARY 2002

24

POST OFFICE BOX 655303

MECHANICAL DATA

PAP (S-PQFP-G64)

PowerPAD

 PLASTIC QUAD FLATPACK

Thermal Pad

(See Note D)

0,13 NOM

0,25

0,45

0,75

Seating Plane

4147702/A 01/98

Gage Plane

0,17

0,27

33

16

48

1

7,50 TYP

49

64

SQ

9,80

1,05

0,95

11,80

12,20

1,20 MAX

10,20

SQ

17

32

0,08

0,50

M

0,08

0

°–7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments.