VISHAY

BC856 to BC859

Document Number 85135

Rev. 1.2, 08-Sep-04

Vishay Semiconductors

www.vishay.com

5

Thickness: Fiberglass 1.5 mm (0.059 in.)

Copper leads 0.3 mm (0.012 in.)

17451

15 (0.59)

12 (0.47)

0.8 (0.03)

5 (0.2)

7.5 (0.3)

3 (0.12)

1 (0.4)

1 (0.4)

2 (0.8)

2 (0.8)

1.5 (0.06)

5.1 (0.2)

Figure 1. Admissible Power Dissipation vs. Temperature of

Substrate Backside

mW

500

400

300

200

100

0

0

100

200 °C

Ptot

TSB

19195

Figure 2. Pulse Thermal Resistance vs. Pulse Duration

(normalized)

-1

10

10

1s

10

10

10

10

10

10

-1

-2

-3

-4

-5

-6

tp

tp

P

I

T

T

ν =

0.2

0.5

0.1

0.05

0.02

0.01

0.005

ν =0

-2

10

-3

10

rthSB

R thSB

19191