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DAC38RF82 Datasheet(PDF) 7 Page - Texas Instruments

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Part # DAC38RF82
Description  Dual-Channel, Differential-Output, 14-Bit, 9-GSPS, RF-Sampling DAC With JESD204B Interface, On-Chip PLL and Wide-Band Interpolation
PDF  140 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DAC38RF82 Datasheet(HTML) 7 Page - Texas Instruments

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7
DAC38RF82, DAC38RF89
www.ti.com
SLASEA6B – FEBRUARY 2017 – REVISED AUGUST 2017
Product Folder Links: DAC38RF82 DAC38RF89
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Measured with respect to AGND or DGND.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply Voltage Range(2)
VDDDAC1, VDDDIG1, VDDL1_1, VDDL2_1,
VDDCLK1, VDDT1, VDDCLK1, VDDTX1, VDDE1
–0.3
1.3
V
VDDR18, VDDIO18, VDDS18, VDDAPLL18,
VDDAREF18, VDDAOUT18, VDDA18,
VDDAVCO18, VDDTX18
–0.3
2.45
V
VEE18N
–2
0.3
V
Voltage between AGND and DGND
–0.3
0.3
V
Pin Voltage Range(2)
RX[0..7]+/-
–0.5
VDDDIG1 + 0.5 V
V
SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM,
RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST,
TESTMODE, GPI0, GPI1, GPO0, GPO1
–0.5
VDDIO + 0.5 V
V
CLKOUT+/-
–0.5
VDDTX18 + 0.5 V
V
DACCLK+/-, SYSREF+/-, DACCLKSE
–0.5
VDDCLK1 + 0.5 V
V
SYNC0+/-, SYNC1+/-
–0.5
VDDS18 + 0.5 V
V
IOUT1+/-, IOUT2+/-
–0.5
VDDAOUT18 + 0.5 V
V
RBIAS, EXTIO, ATEST
–0.5
VDDAOUT18 + 0.5 V
V
IFORCE, VSENSE
–0.5
VDDDIG1 + 0.5 V
V
AMUX1, AMUX0
–0.5
VDDT1 + 0.5 V
V
Peak input current (any input)
20
mA
Peak total input current (all inputs)
–30
mA
Junction temperature TJ
150
°C
Operating free-air temperature, TA
–40
85
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±250
(1)
Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TJ
Recommended operating temperature
105
°C
Maximum rated operating junction temperature(1)
125
°C
TA
Recommended free-air temperature
–40
85
°C
Supply Voltage Range
VDDA18, VDDAPLL18, VDDS18,
VDDIO18, VDDR18, VDDAPLL18,
VDDOUT18, VDDAVCO18
1.71
1.8
1.89
V
VDDDIG1 VDDA1, VDDT1, VDDAPLL1,
VDDCLK1, VDDL1_1, VDDL2_1,
VDDTX1, VDDE1
0.95
1
1.05
VEE18N
–1.89
–1.8
–1.71



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