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TFP510 Datasheet(PDF) 7 Page - Texas Instruments |
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TFP510 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 27 page ![]() TFP510 TI PanelBus DIGITAL TRANSMITTER SLDS146B – JANUARY 2002 – REVISED DECEMBER 2002 7 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) dc specifications PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT VIH High level input voltage (CMOS input) VREF = DVDD 0.7VDD V VIH High–level input voltage (CMOS input) 0.55 V ≤ VREF ≤ 0.9 V VREF + 0.2 V VIL Low level input voltage (CMOS input) VREF = DVDD 0.3 VDD V VIL Low–level input voltage (CMOS input) 0.55 V ≤ VREF ≤ 0.9 V VREF – 0.2 V VOH High-level digital output voltage (open-drain output) VDD = 3 V IOH = 20 µA 2.4 V VOL Low-level digital output voltage (open-drain output) VDD = 3.6 V IOL = 4 mA 0.4 V IIH High-level input current VI = 3.6 V ±25 µA IIL Low-level input current VI = 0 ±25 µA V(H) DVI single-ended high-level output voltage AVDD – 0.01 AVDD + 0.01 V V(L) DVI single-ended low-level output voltage AVDD = 3.3 V ±5% r(T)‡ =50 Ω ±10% AVDD – 0.6 AVDD – 0.4 V V(SWING) DVI single-ended output swing voltage r(T)‡ = 50 Ω ±10% r(TFADJ) = 510 Ω ±1% 400 600 mVP–P V(OFF) DVI single-ended standby/off output voltage r(TFADJ) = 510 Ω ±1% AVDD – 0.01 AVDD + 0.01 V I(PD) Power-down current (see Note 3) 200 500 µA I(IDD) Normal power supply current Worst case pattern§ 200 250 mA ‡ r(T) is the single-ended termination resistance at the receiver end of the DVI link. § Black and white checkerboard pattern, each checker is one pixel wide. NOTE 3: Assumes all inputs to the transmitter are not toggling. ac specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT f(IDCK) IDCK frequency 25 165 MHz t(pixel) Pixel time period (see Note 4) 6.06 40 ns t(IDCK) IDCK duty cycle 30% 70% t(ijit) IDCK clock jitter tolerance 2 ns tr DVI output rise time (20–80%) (see Note 5) 75 240 tf DVI output fall time (20–80%) (see Note 5) 75 240 ps tsk(D) DVI output intra-pair + to – differential skew (see Note 6) f(IDCK) = 165 MHz 50 s tsk(CC) DVI output inter-pair or channel-to-channel skew (see Note 6) f(IDCK) 165 MHz 1.2 ns tojit Output clock jitter, maximum (see Note 7) 150 ps tsu(IDF) Data, DE, VSYNC, HSYNC setup time to IDCK+ falling edge Single edge (BSEL 1 DSEL 0 1.2 ns th(IDF) Data, DE, VSYNC, HSYNC hold time to IDCK+ falling edge (BSEL = 1, DSEL = 0, DKEN = 0, EDGE = 0) 1.3 ns tsu(IDR) Data, DE, VSYNC, HSYNC setup time to IDCK+ rising edge Single edge (BSEL 1 DSEL 0 1.2 ns th(IDR) Data, DE, VSYNC, HSYNC hold time to IDCK+ rising edge (BSEL = 1, DSEL = 0, DKEN = 0, EDGE = 1) 1.3 ns tsu(ID) Data, DE, VSYNC, HSYNC setup time to IDCK+ falling/rising edge Dual edge (BSEL 0 DSEL 1 0.9 ns th(ID) Data, DE, VSYNC, HSYNC hold time to IDCK+ falling/rising edge (BSEL = 0, DSEL = 1, DKEN = 0) 1 ns t(STEP) De-skew trim increment DKEN = 1 350 ps NOTES: 4. t(pixel) is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t(pixel). 5. Rise and fall times are measured as the time between 20% and 80% of signal amplitude. 6. Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger. 7. Relative to input clock (IDCK). |
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