iC-GF

TRANSCEIVER

Rev F1, Page 4/30

PACKAGING INFORMATION

PIN CONFIGURATION QFN24 4 mm x 4 mm

1

2

3

4

5

6

7 8 9 10 11 12

13

14

15

16

17

18

19

20

21

22

23

24

TP

PIN FUNCTIONS

No. Name

Function

1 ISET

Reference Current for current limitation

of driver outputs

2 INV1

Inverting Input Channel 1

ESPI

Enable SPI (pin open)

3 IN1

Input Channel 1

TX

Transmission Input (SPI mode)

4 QCFG1 Configuration Input Channel 1

NCS

Chip Select (SPI mode)

PIN FUNCTIONS

No. Name

Function

5 QCFG2 Configuration Input Channel 2

SCLK

Serial Clock (SPI mode)

6 IN2

Input Channel 2

MOSI

Master Output Slave Input (SPI mode)

7 OEN

Output Enable Input

8 NOVL

Overload Error Output

NDIAG Diagnosis Output (SPI mode)

9 NUVD

Undervoltage Error Output

MISO

Master Input Slave Output (SPI mode)

10 CFO

Feedback Channel Output

RX

Transmission Output (SPI mode)

11 CFP

Configuration Input Feedback Channel

12 CFI

Feedback Channel Input

13 QP2

High Side Switch Output Channel 2

14 QN2

Low Side Switch Output Channel 2

15 VN

Ground

16 QN1

Low Side Switch Output Channel 1

17 QP1

High Side Switch Output Channel 1

18 VBO

Power Supply

19 VBR

Power Supply for switching converter

20 VHL

Inductor Switching Converter

21 VH

Input Linear Regulators

22 VCC

5 V Sensor Supply

23 VCC3

3.3 V Sensor Supply

24 GND

Sensor Ground

The Thermal Pad is to be connected to a Ground Plane (VN) on the PCB.

Only pin 1 marking on top or bottom defines the package orientation (iC-GF label and coding is subject

to change).

Do not short circuit line side ground (pin VN) and sensor side ground (pin GND). Otherwise interferences

introduced at the line side may affect the sensor function.