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AD7764

Data Sheet

Rev. B | Page 8 of 33

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

AVDD1 to Ground

−0.3 V to +2.8 V

AVDD2, AVDD3, AVDD4 to Ground

−0.3 V to +6 V

DVDD to Ground

−0.3 V to +2.8 V

VINA+, VINA− to Ground1

−0.3 V to +6 V

VIN+, VIN− to Ground1

−0.3 V to +6 V

Digital Input Voltage to Ground2

−0.3 V to +2.8 V

VREF+ to Ground3

−0.3 V to +6 V

AGND to DGND

−0.3 V to +0.3 V

Input Current to Any Pin Except Supplies4

±10 mA

Operating Temperature Range, Commercial

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

θJA Thermal Impedance (1s0p)5

143°C/W

θJA Thermal Impedance (2s2p)6, 7

71.1°C/W

θJC Thermal Impedance8

20°C/W

Solder Reflow Temperature9

260°C

ESD

1 kV

The absolute maximum voltage for VIN−, VIN+, VINA−, and VINA+ is 6.0 V or

AVDD3 + 0.3 V, whichever is lower.

The absolute maximum voltage on the digital input is 3.0 V or DVDD+ 0.3 V,

whichever is lower.

The absolute maximum voltage on the VREF+ input is 6.0 V or AVDD4 + 0.3 V,

whichever is lower.

Transient currents of up to 100 mA do not cause SCR latch-up.

1s0p means a single-layer printed circuit board (PCB), which includes

one signal layer and zero power layers.

2s2p means a 4-layer PCB, which includes 2 signal layers and 2 power layers.

θJA for a 2s2p PCB is derived from simulation.

The revised θJC (thermal impedance) is derived from simulation.

Maximum reflow temperature as per JEDEC J-SDT-020.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ESD CAUTION

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