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SSD1852 Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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SSD1852 Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers |
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9 / 55 page ![]() SSD1852 Rev 1.0 01/2003 SOLOMON 4 5 DIE PAD ARRANGEMENT Figure 2 - Die Pad Assignment Note: 1. Diagram showing the face of the die. 2. Coordinates are reference to center of the chip. 3. Unit of coordinates and Size of all alignment marks are in µm. 4. All alignment keys do not contain gold bump. Die Size: 10.49 mm x 1.72mm Die Thickness: 533±25µm Bump Height: Typical 18µm Bump co-planarity <3µm (within die) 25 25 25 25 25 25 100 100 25 25 25 25 50 100 100 18 100 75 100 |
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