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MP2454 Datasheet(PDF) 12 Page - Monolithic Power Systems

Part # MP2454
Description  36V, 0.6A Step-Down Converter
PDF  19 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2454 Datasheet(HTML) 12 Page - Monolithic Power Systems

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MP2454―36V, 0.6A, STEP-DOWN CONVERTER
MP2454 Rev. 1.01
www.MonolithicPower.com
12
9/18/2015
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2015 MPS. All Rights Reserved.
capacitor, add external circuitry to ensure that the
bootstrap voltage is in the normal operation
region.
Low Dropout Operation (LDO)
The MP2454 is designed to operate at a 100%
duty cycle as long as the voltage difference
across BST to SW is greater than 2.5V; this
improves dropout. When the voltage from BST to
SW drops below 2.5V, an under-voltage lockout
(UVLO) circuit turns off the high-side MOSFET
(HS-FET), and an internal low-current switch
pulls the SW node low to refresh the charge on
the BST capacitor. After the BST capacitor
voltage is re-charged, the HS-FET turns on again
to regulate the output. Since the supply current
sourced from the BST capacitor is low, the HS-
FET can remain on for more switching cycles
than are required to refresh the capacitor, thus
increasing the effective duty cycle of the
switching regulator. The low-dropout operation
makes the MP2454 suitable for the automotive
cold crank.
The voltage drop across the power MOSFET, the
inductor resistance, the low-side diode, and the
printed circuit board resistance influence heavily
the effective duty cycle during regulator dropout.
Enable Control and Frequency
Synchronization
EN/SYNC is a digital control pin that turns the
regulator on and off. When EN is pulled below 1V
for longer than 2µs, the chip enters the lowest
shutdown current mode. Forcing EN/SYNC
above 1.8V for longer than 200ns turns on the
device. Internally, a 1.2MΩ resistor is connected
from EN to GND. So when left floating, the
device pulls EN down to GND, and the chip is
disabled.
A Zener diode is connected from EN to GND
internally. The typical clamping voltage of the
Zener diode is 7.5V, so VIN can be connected to
EN through a high value resistor if the system
does not have another logic input acting as an
enable signal. The resistor needs to be designed
to limit the EN sink current to less than 150μA.
An external clock with a frequency range of
350kHz to 2.3MHz can be used to synchronize
the device through EN/SYNC. The internal
clock’s rising edge is synchronized to the
external clock’s rising edge.
If a clock on period exceeds 4µs or an off period
exceeds 2µs, the device interprets the signal as
an enable input and disables synchronization.
Frequency Programmable
An external resistor (RFREQ) from FREQ to GND
sets the MP2454’s oscillating frequency. For
additional details on the relationship between
RFREQ and fS, refer to the “Application Information”
section.
The oscillating frequency is related to the FB
voltage. When the FB voltage decreases, the
oscillating frequency decreases accordingly and
becomes one fifth of the nominal value (when FB
is 0). This frequency foldback scheme prevents
inductor current runaway during start-up or an
output short circuit.
Under-Voltage Lockout (UVLO)
VIN UVLO protects the chip from operating at an
insufficient supply voltage. The UVLO rising
threshold is 2.9V while its falling threshold is
2.65V.
Soft Start (SS)
Soft start (SS) prevents the converter output
voltage from overshooting during start-up. When
the soft-start period begins, an internal current
source charges the external soft-start capacitor.
When the SS voltage falls below the internal
reference (REF), the SS overrides REF as the
error amplifier reference. When SS exceeds REF,
REF acts as the reference.
The SS time is calculated with Equation (1):
(V)
V
A)
(
I
(ms)
t
(nF)
C
REF
SS
SS
SS
(1)
Where ISS is the soft-start current, and VREF is the
0.8V reference voltage. It can be used for
tracking and sequencing.
Thermal Shutdown (TSD)
Thermal shutdown prevents the chip from
thermal runaway. When the die temperature
exceeds the upper threshold (170oC), the entire



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