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MP5512 Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP5512 Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 22 page ![]() MP5512 – 18V, 4.5A ENERGY STORAGE AND MANAGEMENT UNIT MP5512 Rev. 1.1 www.MonolithicPower.com 3 4/27/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ..........................-0.3V to 20V VB, VBO .........................................-0.3V to 20V VSTRG, VRTEST ...................................-0.3V to 50V VSW................-0.3V(-4V for <5ns) to VSTRG+0.3V VBST .....................................-0.3V to VSTRG+6.5V VCST.................................................-0.3V to 28V All Other Pins...............................–0.3V to 6.5 V EN, ENCH Current................................ 0.3mA(2) Continuos Power Dissipation (TA = +25°C) (3) ........................................................... 3.28W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature.............. –65°C to +150°C Recommended Operating Conditions (4) Supply Voltage VIN ..............................4V to 18V Bus Voltage VB....................................4V to 18V Storage Voltage VSTRG ...........VIN_MAX+3V to 40V Max. Input Current ...................................... 4.5A Max. Buck-Release Current........................... 3A EN, ENCH Current.................... 0mA to 0.2mA(2) Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (5) θJA θJC QFN-28 (4mmx5mm) ……. …..38 8 °C/W Notes: 1) Exceeding these ratings may damage the device. 2) Refer to the “Enable Control” section. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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