LTC3124 datasheet(3/28 Pages) LINER

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LTC3124

3124f

For more information www.linear.com/LTC3124

ELECTRICAL CHARACTERISTICS

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Voltage transients on the SW pin beyond the DC limit specified in

the Absolute Maximum Ratings are non-disruptive to normal operations

when using good layout practices, as shown on the demo board or

described in the data sheet or application notes.

Note 3: The LTC3124 is tested under pulsed load conditions such that

TA ≈ TJ. The LTC3124E is guaranteed to meet performance specifications

from 0°C to 85°C junction temperature. Specifications over the –40°C

to 125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

LTC3124I is guaranteed to meet specifications over the –40°C to 125°C

operating junction temperature range. The LTC3124H is guaranteed to

meet specifications over the full –40°C to 150°C operating junction range.

High junction temperatures degrade operating lifetimes; operating lifetime

is derated for junction temperatures greater than 125°C.

Note that the maximum ambient temperature consistent with these

specifications is determined by specific operating conditions in

conjunction with board layout, the rated package thermal impedance

and other environmental factors. The junction temperature (TJ in °C) is

calculated from the ambient temperature (TA in °C) and power dissipation

(PD in Watts) according to the formula:

TJ = TA + (PD • θJA)

where

θJA is the thermal impedance of the package.

Note 4: The LTC3124 includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 150°C when overtemperature shutdown is active.

Continuous operation above the specified maximum operating junction

temperature may result in device degradation or failure.

Note 5: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal impedance much higher than

the rated package specifications.

The l denotes the specifications which apply over the specified operating

junction temperature range, otherwise specifications are at TA = 25°C (Note 3). VIN = 3.6V, VOUTA = VOUTB = 12V, RT = 28k unless

otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Minimum Start-Up Voltage

VOUT = 0V

1.6

1.8

Input Voltage Range

VOUT ≥ 2.5V

0.5

5.5

Output Voltage Adjust Range

2.5

Feedback Voltage

1.176

1.200

1.224

Feedback Input Current

FB = 1.4V

Quiescent Current, Shutdown

SD = 0V, VOUT = 0V, Not Including Switch Leakage

0.2

µA

Quiescent Current, Active

FB = 1.4V, Measured on VIN, Non-Switching

600

840

µA

Quiescent Current, Burst

Measured on VIN, FB = 1.4V

Measured on VOUT, FB = 1.4V

µA

N-Channel MOSFET Switch Leakage Current

SW = 15V, VOUT = 15V, Per Phase

0.1

µA

P-Channel MOSFET Switch Leakage Current

SW = 0V, VOUT = 15V, SD = 0V, Per Phase

0.1

µA

N-Channel MOSFET Switch On-Resistance

Per Phase

0.130

P-Channel MOSFET Switch On-Resistance

Per Phase

0.200

N-Channel MOSFET Peak Current Limit

Per Phase

2.5

3.5

4.5

Maximum Duty Cycle

FB = 1.0V

Minimum Duty Cycle

FB = 1.4V

Switching Frequency

Per Phase

0.83

1.17

MHz

SYNC Frequency Range

0.2

6.0

MHz

PWM/SYNC Input High Voltage

0.9 • VCC

PWM/SYNC Input Low Voltage

0.1 • VCC

PWM/SYNC Input Current

VPWM/SYNC = 5.5V

0.01

µA

CAP Clamp Voltage

VOUT > 6.2V, Referenced to VOUT

–5.0

–5.4

–5.8

VCC Regulation Voltage

VIN < 2.8V, VOUT > 5V

3.9

4.25

4.6

Error Amplifier Transconductance

100

130

µS

Error Amplifier Sink Current

FB = 1.6V, VC = 1.15V

µA

Error Amplifier Source Current

FB = 800mV, VC = 1.15V

–25

µA

Soft-Start Time

SD Input High Voltage

1.6

SD Input Low Voltage

0.25

SD Input Current

SD = 5.5V

µA

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