K64F datasheet(20/85 Pages) NXP

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2.4.1 Thermal operating requirements

Table 12. Thermal operating requirements

Symbol

Description

Min.

Max.

Unit

Die junction temperature

–40

125

°C

Ambient temperature1

–40

105

°C

1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed maximum TJ. The simplest method to

determine TJ is:

TJ = TA + RθJA x chip power dissipation

2.4.2 Thermal attributes

Table 13. Thermal attributes

Board type

Symbol

Descriptio

144 LQFP

144

MAPBGA

121

XFBGA

100 LQFP

Unit

Notes

Single-layer

(1s)

RθJA

Thermal

resistance,

junction to

ambient

(natural

convection)

38.1

33.3

°C/W

Four-layer

(2s2p)

RθJA

Thermal

resistance,

junction to

ambient

(natural

convection)

21.6

21.1

°C/W

Single-layer

(1s)

RθJMA

Thermal

resistance,

junction to

ambient

(200 ft./min.

air speed)

30.8

26.2

°C/W

Four-layer

(2s2p)

RθJMA

Thermal

resistance,

junction to

ambient

(200 ft./min.

air speed)

17.8

°C/W

—

RθJB

Thermal

resistance,

junction to

board

16.5

16.3

°C/W

—

RθJC

Thermal

resistance,

8.9

°C/W

Table continues on the next page...

General

Kinetis K64F Sub-Family Data Sheet, Rev. 7, 11/2016

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