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ML9042 Datasheet(PDF) 55 Page - OKI electronic componets |
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ML9042 Datasheet(HTML) 55 Page - OKI electronic componets |
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55 / 58 page ![]() FEDL9042-01 OKI Semiconductor ML9042-xx 55/58 ML9042-xx CVWA GOLD BUMP SPECIFICATION (HIGH HARDNESS) Gold Bump Specification (Unit: µm) Symbol Parameter MIN TYP MAX A Bump Pitch (I/O Section: Pitch Direction) 70 — — B Bump Size (I/O Section: Pitch Direction) 40 44 48 C Bump Size (I/O Section: Depth Direction) 96 100 104 D Bump-to-Bump Distance (I/O Section: Pitch Direction) 22 26 30 E Bump Size (L-mark Section: Length) 76 80 84 F Bump Size (L-mark Section: Width) 26 30 34 G Sliding of Total Bump Pitches — — 2 Bump Height 10 15 20 H Bump Height Dispersion Inside Chip (Range) — — 4 I Bump Edge Height — — 5 J Shear Strength (g) 27 — — K Bump Hardness (Hv: 25 g load) 50 90 130 Wafer Thickness; 625 ±20 µm Chip Size; 7.80 mm × 1.80 mm Top View and Cross Section View B D [Cross Section View] [I/O Section] [L-Alignment Mark] A |
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