5

AMC1336

www.ti.com

SBAS951 – AUGUST 2019

Product Folder Links: AMC1336

Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

AMC1336

UNIT

DWV (SOIC)

8 PINS

Junction-to-ambient thermal resistance

112.2

°C/W

Junction-to-case (top) thermal resistance

47.6

°C/W

Junction-to-board thermal resistance

60

°C/W

Junction-to-top characterization parameter

23.1

°C/W

Junction-to-board characterization parameter

60

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Maximum power dissipation (both sides)

AVDD = DVDD = 5.5 V

88

mW

AVDD = DVDD = 3.6 V

50.4

Maximum power dissipation (high-side supply)

AVDD = 5.5 V

55

mW

AVDD = 3.6 V

32.4

Maximum power dissipation (controller-side supply)

DVDD = 5.5 V

33

mW

DVDD = 3.6 V

18