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LMH6321 Datasheet(PDF) 1 Page - Texas Instruments

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Part # LMH6321
Description  BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer
PDF  41 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LMH6321 Datasheet(HTML) 1 Page - Texas Instruments

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BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer
1 Features
• Pin-Selected Bandwidth: 35 MHz to 210 MHz
• High Output Current: 250 mA
• Slew Rate: 3750 V/µs
• Low Quiescent Current: 1.5 mA (35-MHz BW)
• Wide Supply Range: ±2.25 V to ±18 V
• Internal Output Current Limit
• Thermal Shutdown Protection
• Available in Packages with Thermal Pad
• Extended Temperature Operation:
–40°C to +125°C
2 Applications
• Memory, Semiconductor Testers
• Test Equipment
• Headphone Drivers
• Flight Control Systems
• Capacitive Load Drivers
• Valve Drivers, Solenoid Drivers
• Line Drivers
3 Description
The BUF634A device is a high-performance, high-
fidelity, open-loop buffer that is capable of driving 250
mA of output current. The BUF634A is a 36-V device
with an adjustable bandwidth of 35 MHz to 210 MHz,
which is accomplished by varying the value of an
external resistor between the V– and BW pins.
The BUF634A device can be used as a standalone
open-loop driver, or used inside the feedback loop of
a precision op amp to provide both high-precision and
large output current drive with improved capacitive
load drive.
For low-power applications, the BUF634A device
operates on a 1.5-mA quiescent current with a 250-
mA output, 3750-V/µs slew rate, and 35-MHz
bandwidth. The device consumes 8.5-mA quiescent
current in wide-bandwidth mode with a 210-MHz
bandwidth. The BUF634A is fully protected by an
internal current limit in its output stage and by thermal
shutdown, making the device rugged and easy to use.
The BUF634A device is rated to function over the
extended industrial temperature range of –40°C to
+125°C. The BUF634A comes in three packages: D
(SOIC), DRB (VSON), and DDA (HSOIC). The DRB
(VSON) and DDA (HSOIC) packages have excellent
thermal performance resulting from the thermal pad
on the bottom side. The DRB package comes in a
very small form factor of 3.0 mm × 3.0 mm, making
the device a very suitable option for portable and size-
constrained applications.
Device Information
PART NUMBER(1)
PACKAGE
BODY SIZE (NOM)
BUF634A
SOIC (8)
4.90 mm × 3.90 mm
VSON (8)(2)
3.00 mm × 3.00 mm
HSOIC (8)
4.90 mm × 3.90 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
(2)
Preview package.
±
Vt
1 kQ
1 kQ
V+
V
O
V
IN
Boost the Output Current of Any Operational
Amplifier
Frequency (Hz)
-120
-110
-100
-90
-80
10
100
1k
10k
D003
RL = 16 :
RL = 32 :
RL = 250 :
THD+N vs Frequency Using the BUF634A with the
OPA2810 (VO = 10 VPP, 90-kHz Measurement
Bandwidth)
www.ti.com
BUF634A
SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020
Copyright © 2020 Texas Instruments Incorporated
Submit Document Feedback
1
Product Folder Links: BUF634A
BUF634A
SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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