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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.3)

(2.4)

(2.8)

6X (0.65)

(1.65)

(

0.2) VIA

TYP

(0.575)

(0.95)

8X (0.6)

(R0.05) TYP

VSON - 1 mm max height

DRB0008B

PLASTIC SMALL OUTLINE - NO LEAD

4218876/A 12/2017

SYMM

1

4

5

8

SCALE:20X

LAND PATTERN EXAMPLE

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

SOLDER MASK DETAILS

DEFINED

(PREFERRED)

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BUF634A

SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020

Copyright © 2020 Texas Instruments Incorporated

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