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LMH6321 Datasheet(PDF) 14 Page - Texas Instruments

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Part # LMH6321
Description  BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer
PDF  41 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LMH6321 Datasheet(HTML) 14 Page - Texas Instruments

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8.3 Feature Description
8.3.1 Output Current
The BUF634A can deliver up to ±250-mA continuous output current. Internal circuitry limits the output current to
approximately ±350 mA. Care must be taken to limit the output voltage swing for a given load resistance to avoid
limiting the output current and degrading linearity; see Figure 9-8. For many applications, however, the
continuous output current is limited by thermal effects. The output voltage swing capability varies with junction
temperature and output current; see Figure 7-17 and Figure 7-18. Care must be taken to operate the device
below the maximum-recommended junction temperature in applications using this buffer in wide-bandwidth
mode with a wide supply voltage and large output current to avoid permanent damage to the device.
8.3.2 Thermal Shutdown
Power dissipated in the BUF634A causes the junction temperature to rise. A thermal protection circuit in the
BUF634A disables the output when the junction temperature reaches approximately 180°C. When the thermal
protection is activated, the output stage is disabled and the output current is limited, allowing the device to cool.
Quiescent current is approximately 12 mA during thermal shutdown. When the junction temperature cools to
approximately 160°C, the output circuitry is again enabled. This process can cause the protection circuit to cycle
on and off with a period ranging from a fraction of a second to several minutes or more, depending on package
type, signal, load, and thermal environment.
The thermal protection circuit is designed to prevent damage during abnormal conditions. Any tendency to
activate the thermal protection circuit during normal operation is a sign of an inadequate heat sink or excessive
power dissipation for the package type.
8.3.3 ESD Protection
As shown in Figure 8-1, all device pins are protected with internal ESD protection diodes to the power supplies.
These diodes provide moderate protection to input overdrive voltages above the supplies. The protection diodes
can typically support 10-mA continuous currents. Current limiting series resistors must be added at the inputs if
common-mode voltages higher than the supply voltages are possible. Keep these resistor values as low as
possible because using high values degrades noise performance and frequency response. VIN is a non fail-safe
pin. Ensure V+ and V– are powered up before applying a signal to the VIN pin. Failure to do so results in current
flowing through the ESD diode. Restrict any current flowing through the ESD diodes to less than 10 mA.
Power Supply
ESD Cell
BW
VIN
VO
V+
V±
RIN
Figure 8-1. Internal ESD Protection
BUF634A
SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020
www.ti.com
14
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Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: BUF634A



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