EM4095

Copyright

 2002, EM Microelectronic-Marin SA

3

www.emmicroelectronic.com

Absolute Maximum Ratings

Parameter

Symbol

Conditions

Storage temperature

T

STO

-55 to +150°C

V

DDmax

V

DDmin

Max. voltage other pads

V

MAX

Min. voltage other pads

V

MIN

Max. junction temperature

T

JMAX

+125°C

Electrostatic discharge max.

to MIL-STD-883C method

V

ESD

4000V

Electrostatic discharge max.

to MIL-STD-883C method

3015 (only for pins ANT1

V

ESD_ANT

10000V

Maximum Input/Output

current on all pads except

VDD, VSS, DVDD, DVSS,

ANT1, ANT2, RDY/CLK

I

IMAX

I

OMAX

10mA

Maximum AC peak current

on ANT1 and ANT2 pads

100 kHz duty cycle 50%

I

ANTmax

300mA

Stresses above these listed maximum ratings may cause

permanent damages to the device. Exposure beyond

specified operating conditions may affect device reliability

or cause malfunction.

Handling Procedures

This device has built-in protection against high static

voltages or electric fields; however, anti-static precautions

must be taken as for any other CMOS component. Unless

otherwise specified, proper operation can only occur when

all terminal voltages are kept within the voltage range.

Unused inputs must always be tied to a defined logic

voltage level.

Operating Conditions

Parameter

Symb Min

Typ

Max

Units

Operating junction

temperature

T

J

-40

+110

°C

Supply voltage

V

DD

4.1

5

5.5

V

Antenna circuit

resonant frequency

F

RES

100

125

150

kHz

AC peak current on

ANT1 & ANT2 pads

I

ANT

250

mA

*10

*

nF

*

100

*

nF

*6.80

*

nF

100

220

nF

Package thermal

resistor SO16

69

70

71

°C/W

** According to 1S2P JEDEC test board

Due to antenna driver current the internal junction temperature is

higher than ambient temperature. Please calculate ambient

temperature range from max. antenna current and package

Thermal Resistor. It is the user's responsibility to guarantee that

Supply voltage (V

capacitor (to V