HD3SS213 datasheet(6/29 Pages) TI

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Typical values for all parameters are at VCC = 3.3 V and TA = 25°C (unless otherwise noted). All temperature limits are

specified by design.

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

Ioff

Device shut down current

VDD = 3.6 V, OE = GND

2.5

µA

IDD

Supply current

VDD = 3.6 V,

Dx_SEL or AUX_SEL = VDD or GND

0.6

DA, DB, DC HIGH SPEED SIGNAL PATH

CON

Outputs ON capacitance

VI = 0 V, outputs open, switch ON

1.5

COFF

Outputs OFF capacitance

VI = 0 V, outputs open, switch OFF

RON

ON resistance

VDD = 3.3 V, VCM = 0.5 V to 1.5 V,

IO = –40 mA

ΔRON

ON resistance match between

pairs of the same channel

VDD = 3.3 V, 0.5 V ≤ VI ≤ 1.2V,

IO = –40 mA

1.5

RFLAT_ON

ON resistance flatness,

RON(max) – RON(min)

VDD = 3.3 V, 0.5 V ≤ VI ≤ 1.2 V

1.3

AUXx, DDC SIGNAL PATH

CON

Outputs ON capacitance

VI = 0 V, outputs open, switch ON

COFF

Outputs OFF capacitance

VI = 0 V, outputs open, switch OFF

RON(AUX) ON resistance

VDD = 3.3 V, VCM = 0 V – VDD, IO = –8 mA

RON(DDC) ON resistance on DDC channel VDD = 3.3 V, VCM = 0.4 V, IO = –3 mA

6.4 Thermal Information

THERMAL METRIC

HD3SS213

UNIT

nFBGA (ZXH)

50 PIN

RθJA

Junction-to-ambient thermal resistance

72.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

35.9

°C/W

RθJB

Junction-to-board thermal resistance

43.1

°C/W

ψJT

Junction-to-top characterization parameter

1.6

°C/W

ψJB

Junction-to-board characterization parameter

42.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

6.5 Electrical Characteristics

over recommended operating conditions; RL and RSC = 50 Ω (unless otherwise noted)(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Dx differential return loss

1.35 GHz

–17

2.7 GHz

–13

XTALK

Dx differential crosstalk

2.7 GHz

–50

OIRR

Dx differential off-isolation

2.7 GHz

–25

Dx differential insertion loss

f = 1.35 GHz

–1

f = 2.7 GHz

–1.5

AUX –3-dB bandwidth

360

MHz

(1)

For return loss, crosstalk, off-isolation, and insertion loss values, the data was collected on a Rogers material board with minimum

length traces on the input and output of the device under test.

HD3SS213

SLAS901C – DECEMBER 2016 – REVISED JANUARY 2021

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