AD9988 datasheet(20/40 Pages) AD

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Data Sheet

AD9988

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 20 of 40

Table 19.

Parameter

Rating

ISET, DACxP, DACxN, TDP, TDN

−0.3 V to AVDD2 + 0.3 V

VCO_COARSE, VCO_FINE, VCO_VCM,

VCO_VREG

−0.3 V to AVDD2_PLL + 0.3 V

Rx Input Power (ADC0P/N, ADC1P/N,

ADC2P/N, ADC3P/N)1

22 dBm

VCM0, VCM1

−0.3 V to RVDD2 + 0.3 V

CLKINP, CLKINN

−0.2 V to PLLCLKVDD1 + 0.2 V

ADCDRVN, ADCDRVP

−0.2 V to CLKVDD1 + 0.2 V

SERDINx±, SERDOUTx±

−0.2 V to SVDD1 + 0.2 V

SYSREFP, SYSREFN, and SYNCxINB±

−0.2 V to +2.5 V

SYNCxOUTB±, SYNCxINB±, RESETB,

TXENx, RXENx, IRQB_x, CSB, SCLK,

SDIO, SDO, TMU_REFN, TMU_REFP,

ADCx_SMON0, ADCx_SMON1,

ADCx_FD0, ADCx_FD1, GPIOx

−0.3 V to DVDD1P8 + 0.3 V

AVDD2, AVDD2_PLL, BVDD2, RVDD2,

SVDD2_PLL, DVDD1P8

−0.3 V to +2.2 V

PLLCLKVDD1, AVDD1, AVDD1_ADC,

CLKVDD1, FVDD1, DAVDD1, DVDD1_RT,

DCLKVDD1, SVDD1, SVDD1_PLL

−0.2 V to +1.2 V

VNN1

−1.1 V to +0.2 V

Temperature Ranges

Maximum Junction (TJ)2

120°C

Storage

−65°C to +150°C

1 Tested continuously for 1000 hours with fIN = 4.7 GHz pulsed

and continuous tone at maximum allowed junction temperature (TJ).

Refer to UG-1578, the device user guide, for more information.

2 Do not exceed this temperature for any duration of time when the

device is powered.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. The use of appropriate thermal management techni-

ques is recommended to ensure that the maximum TJ does not

exceed the limits shown in Table 19.

θJA is the natural convection, junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC_TOP is the junction to case, thermal resistance.

θJB is the junction to board, thermal resistance.

Table 20. Simulated Thermal Resistance1

PCB Type

Airflow Velocity (m/

sec)

θJA

θJC_TOP θJB

Unit

JEDEC 2s2p Board 0.0

11.7

0.40

2.3

°C/W

1 Thermal resistance values specified are simulated based on JE-

DEC specifications in compliance with JESD51-12 with the device

power equal to 9 W.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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