XCL231 datasheet(19/37 Pages) TOREX

19 / 37 page

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XCL230/XCL231

Series

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NOTES ON USE (Continued)

10) Pattern Layout Instructions

(1) The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is

high. Please place the input capacitor (CIN1, CIN2) and the output capacitor (CL) as close to the IC as possible.

(2) In order to stabilize the VIN voltage level, we recommend that a bypass capacitor (CIN1, CIN2) be connected as close as

possible to the VIN and GND pins.

(3) Please mount each external component as close to the IC as possible.

(4) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

(5) Make sure that the GND traces are as thick as possible, as variations in ground potential caused

by high ground currents at the time of switching may result in instability of the IC.

(6) This product has a built in driver FET, which causes heat generation from the on resistance, so take measures to dissipate

the heat when necessary.

< Reference Pattern Layout >

< Layer1 >

< Layer2 >

< Layer3 >

< Layer4 >

XCL231 Datasheet(PDF) 19 Page - Torex Semiconductor