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TLVM13630 Datasheet(PDF) 6 Page - Texas Instruments |
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TLVM13630 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 30 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings Limits apply over TA = –40°C to +105°C (unless otherwise noted) (1) MIN MAX UNIT Input voltage VIN to AGND, PGND –0.3 40 V EN to AGND, PGND –0.3 40 V PG to AGND, PGND 0 20 V VLDOIN to AGND, PGND –0.3 16 V FB to AGND, PGND –0.3 16 V RT to AGND, PGND –0.3 5.5 V PGND to AGND –1 2 V Output voltage SW to AGND, PGND –0.3 40 V VOUT to AGND, PGND –0.3 16 V VCC to AGND, PGND –0.3 5.5 V Sink current PG sink current – 10 mA TA Operating ambient temperature(2) –40 105 °C TJ Operating IC junction temperature(2) –40 150 °C Tstg Storage temperature –55 150 °C Peak reflow case temperature – °C Maximum number of reflows allowed 3 Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted G Mechanical vibration Mil-STD-883D, Method 2007.2, 20 to 2000 Hz G (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2.5 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1.0 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. TLVM13630 SLVSFT6 – MAY 2021 www.ti.com 6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TLVM13630 |
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