TLVM13630 datasheet(7/30 Pages) TI

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6.3 Recommended Operating Conditions

Limits apply over TA = –40°C to +105°C (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

VIN (input voltage range after start-up)

Output voltage

VOUT

Output current

IOUT

Frequency

FSW set by RT

200

2200

kHz

PG input current

PG pullup voltage

VPG-PU

Operating ambient temperature

-40

105

°C

6.4 Thermal Information

THERMAL METRIC(1)

TLVM13630

UNIT

RDH (QFN)

30 PINS

RθJA

Junction-to-ambient thermal resistance(2)

33.5

°C/W

ψJT

Junction-to-top characterization parameter(3)

4.1

°C/W

ψJB

Junction-to-board characterization parameter(4)

21.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics

(2)

The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 64-mm x 83-mm four-layer PCB with 2 oz.

copper and natural convection cooling. Additional airflow and PCB copper area reduces RθJA. For more information see the Layout

section.

(3)

The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is

the temperature of the top of the device.

(4)

The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB

is the temperature of the board 1mm from the device.

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TLVM13630

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