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TLVM13630 Datasheet(PDF) 23 Page - Texas Instruments

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Part # TLVM13630
Description  TLVM13630 3-V to 36-V Input, 1-V to 6-V Output, 3-A Power Module
PDF  30 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLVM13630 Datasheet(HTML) 23 Page - Texas Instruments

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9 Power Supply Recommendations
The TLVM13630 is designed to operate from an input voltage supply range between 3 V and 36 V. This input
supply must be able to provide the maximum input current and maintain a voltage above the set UVLO voltage.
Ensure that the resistance of the input supply rail is low enough that an input current transient does not cause a
high enough drop at the TLVM13630 supply rail to cause a false UVLO fault triggering and system reset. If the
input supply is located more than a few inches from the TLVM13630, additional bulk capacitance can be required
in addition to the ceramic input capacitance. A 47-μF electrolytic capacitor is a typical choice for this function,
whereby the capacitor ESR provides a level of damping against input filter resonances. A typical ESR of 0.5 Ω
provides enough damping for most input circuit configurations.
10 Layout
The performance of any switching power supply depends as much upon the layout of the PCB as the component
selection. Use the following guidelines to design a PCB with the best power conversion performance, optimal
thermal performance, and minimal generation of unwanted EMI.
10.1 Layout Guidelines
To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 10-1 and
Figure 10-2 show a typical PCB layout. Some considerations for an optimized layout are:
• Use large copper areas for power planes (VIN, VOUT, and GND) to minimize conduction loss and thermal
stress.
• Place ceramic input and output capacitors close to the device pins to minimize high-frequency noise.
• Locate additional output capacitors between the ceramic capacitors and the load.
• Connect AGND to PGND at a single point.
• Place RFBT and RFBB as close as possible to the FB pin.
• Use multiple vias to connect the power planes to internal layers.
10.2 Layout Example
Figure 10-1. Typical Top-Layer Layout
Figure 10-2. Typical Top Layer
10.2.1 Package Specifications
Table 10-1. Package Specifications Table
TLVM13630
VALUE
UNIT
Weight
123
mg
Flammability
Meets UL 94 V-0
MTBF Calculated Reliability
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign
tbd
MHrs
www.ti.com
TLVM13630
SLVSFT6 – MAY 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: TLVM13630



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