6.4 Thermal Information: OPA140

THERMAL METRIC(1)

OPA140

UNIT

D (SOIC)

DBV (SOT)

DGK (VSSOP)

8 PINS

5 PINS

8 PINS

Junction-to-ambient thermal resistance

160

210

180

°C/W

Junction-to-case (top) thermal resistance

75

200

55

°C/W

Junction-to-board thermal resistance

60

110

130

°C/W

Junction-to-top characterization parameter

9

40

N/A

°C/W

Junction-to-board characterization parameter

50

105

120

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2140

THERMAL METRIC(1)

OPA2140

UNIT

D (SOIC)

DGK (VSSOP)

DRG (SON)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

160

180

50.7

°C/W

Junction-to-case (top) thermal resistance

75

55

50.6

°C/W

Junction-to-board thermal resistance

60

130

23.3

°C/W

Junction-to-top characterization parameter

9

N/A

0.9

°C/W

Junction-to-board characterization parameter

50

120

23.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

7.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4140

THERMAL METRIC(1)

OPA4140

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

97

135

°C/W

Junction-to-case (top) thermal resistance

56

45

°C/W

Junction-to-board thermal resistance

53

66

°C/W

Junction-to-top characterization parameter

19

N/A

°C/W

Junction-to-board characterization parameter

46

60

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA140, OPA2140, OPA4140

SBOS498E – JULY 2010 – REVISED JULY 2021

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