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LT3932 Datasheet(PDF) 2 Page - Analog Devices |
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LT3932 Datasheet(HTML) 2 Page - Analog Devices |
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2 / 28 page ![]() LT8386 2 Rev. 0 For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS VIN and EN/UVLO....................................... −0.3V to 60V ISP, ISN, and VOUT...................................... −0.3V to 60V ISP – ISN .........................................................−1V to 1V FB, SS, and VC .......................................... −0.3V to 3.6V CTRL, OVLO, PWM, SYNC/SPRD, and FAULT ...−0.3V to 5V SW, BST, INTVCC, VREF, ISMON, PWMTG, RT, and RP........................................................... (Note 2) Operating Junction Temperature Range (Notes 3, 4) LT8386E ............................................ –40°C to 125°C LT8386J............................................. –40°C to 150°C Storage Temperature Range .............. –65°C to 150°C Maximum Reflow (Package Body) Temperature......................................................260°C (Note 1) TOP VIEW LQFN PACKAGE 28-LEAD (4mm × 5mm) θJA = 25°CW (AS MEASURED ON DEMO BOARD) EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB SW BST INTVCC VIN EN/UVLO OVLO VREF CTRL GND VOUT PWMTG PWM RP SYNC/SPRD RT FAULT 9 10 11 12 13 14 28 27 24 23 17 18 19 20 21 22 16 15 6 5 3 4 2 29 GND 1 7 8 ORDER INFORMATION PARAMETER CONDITIONS MIN TYP MAX UNITS Input Voltage Range 4 56 V VIN Pin Quiescent Current VEN/UVLO = 1.5V, Not Switching VEN/UVLO = 0.3V, Shutdown 3.5 4.5 1.5 mA µA EN/UVLO Threshold (Falling) 1.280 1.330 1.420 V PART NUMBER PART MARKING* FINISH CODE PAD FINISH PACKAGE TYPE** MSL RATING TEMPERATURE RANGE LT8386EV#PBF 8386 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 125°C LT8386JV#PBF –40°C to 150°C AUTOMOTIVE PRODUCTS** LT8386EV#WPBF 8386 e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –40°C to 125°C LT8386JV#WPBF –40°C to 150°C • Contact the factory for parts specified with wider operating temperature ranges. *Device temperature grade is identified by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings Parts ending with PBF are RoHS and WEEE compliant. **The LT8386 packages has the same footprint as a standard 4mm × 5mm QFN Package. **Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C, VIN = 12V, VEN/UVLO = 2V unless otherwise noted. |
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