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FXLS93333 Datasheet(PDF) 5 Page - NXP Semiconductors |
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FXLS93333 Datasheet(HTML) 5 Page - NXP Semiconductors |
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5 / 254 page ![]() NXP Semiconductors FXLS9xxxx Dual channel inertial sensor 6.2 PSI5 application diagrams 6.2.1 PSI5 parallel or universal mode application diagram VBUF IDATA VSS VCC VCE VSS C4 C3 C2 C1 R2 R1 aaa-030556 Figure 3. PSI5 parallel or universal mode application diagram Ref Des Type Description Component value selection and range Purpose R1 General purpose 82 Ω, 5 %, 200 PPM The optimal value of this component should be determined by the system level communication, EMC, and ESD testing. For proper device function, the minimum value can be 0 Ω. The maximum value is determined by the minimum bus voltage provided at the module pin and the minimum operating voltage of the device. To meet the minimum PSI5 operating voltage at the module pin, the maximum resistance including all tolerances is 89.0 Ω.[1] VCC filtering and signal damping R2 General purpose 27 Ω, 5 %, 200 PPM The optimal value of this component should be determined by the system level communication, EMC, and ESD testing. For proper device function, the minimum value can be 0 Ω. The maximum value is determined by the minimum bus voltage provided at the module pin. To meet the minimum PSI5 operating voltage at the module pin, the maximum resistance including all tolerances is 66.6 Ω. If the low response current is used, the maximum resistance including all tolerances is 133 Ω. IDATA filtering and signal damping C1 Ceramic 2.2 nF, 10 %, 50 V minimum, X7R The optimal value of this component should be determined by the system level communication, EMC, and ESD testing VCC power supply decoupling and signal damping. For optimal EMC performance, this component is to be placed as close to the BUS_I and BUSRTN connector pins as possible. C2 Ceramic 15 nF, 10 %, 50 V minimum, X7R The optimal value of this component should be determined by the system level communication, EMC, and ESD testing[2] VCC power supply decoupling. For optimal EMC performance, this component is to be placed as close to the BUS_I and BUSRTN pins as possible. C3 Ceramic 470 pF, 10 %, 50 V minimum, X7R The optimal value of this component should be determined by the system level communication, EMC, and ESD testing IDATA Filtering and Signal Damping Table 4. PSI5 parallel or universal mode external component recommendations FXLS9xxxx All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 6 — 8 February 2021 5 / 254 |
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