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AT25SF321 Datasheet(PDF) 43 Page - Dialog Semiconductor |
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AT25SF321 Datasheet(HTML) 43 Page - Dialog Semiconductor |
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43 / 48 page ![]() 42 AT25SF321 DS-25SF321–047F–8/2017 14. Ordering Information 14.1 Ordering Code Detail AT 2 5 S 3 2 S S D HB 1– – F Designator Product Family Device Density 32 = 32-megabit Interface 1 = Serial Package Option M = 8-pad, 5 x 6 x 0.6 mm UDFN SS = 8-lead, 0.150" wide SOIC S = 8-lead, 0.208" wide SOIC DWF = Die in Wafer Form Device Grade H = Green, NiPdAu lead finish, Industrial temperature range (–40°C to +85°C) Shipping Carrier Option B = Bulk (tubes) T = Tape and reel Y = Tray Operating Voltage D = 2.5V to 3.6V Ordering Code (1) Package Operating Voltage Max. Freq. (MHz) Operation Range AT25SF321-SSHD-B 8S1 2.5V to 3.6V 85MHz Industrial (-40°C to +85°C) AT25SF321-SSHD-T AT25SF321-SHD-B 8S2 AT25SF321-SHD-T AT25SF321-MHD-T 8MA1 AT25SF321-DWF (2) DWF 1. The shipping carrier option code is not marked on the devices. 2. Contact Adesto for mechanical drawing or Die Sales information. Package Type 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8S2 8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC) 8MA1 8-pad (5 x 6 x 0.6mm body), Thermally Enhanced Plastic Ultra Thin Dual Flat No-lead (UDFN) DWF Die in Wafer Form |
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