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TC9496AF Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TC9496AF Datasheet(HTML) 1 Page - Toshiba Semiconductor |
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1 / 48 page ![]() TC9496AF 2002-01-11 1 TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC9496AF 1 Chip Audio Digital Signal Processor TC9496AF is the 1 chip audio DSP which built in 24-bits, a 22.5 MIPS DSP core, 3 ch AD converter, 5 ch DA converter, and electronic volume for trims, and corresponds to a Multi-speaker system. It is possible to realize many application, such as sound field control-hall simulation, for example-, digital filter for equalizers, dynamic range control, KARAOKE and something. Features · Incorporates 3 ch AD converter, 2 ch is 1 bit Σ-∆ type AD converter for HiFi-Audio and 1 ch is 16 bit Multi-bit type AD converter for Microphone. 2 ch HiFi-ADC (1 bitΣ-∆ type) S/N: 96dB (typ.) 1 ch Mic. ADC (16 bit Multi-bit type) S/N: 80dB (typ.) · Incorporates 1 bitΣ-∆ type DA converter, and the attenuator for trims is built in each DAC output. In case of the use which does not use a trim, It is possible to output the analog signal of DAC directly. 5 ch DAC (1 bitΣ-∆ type) S/N: 96dB (typ.) Attenuator for trim 0dB to −24dB (1dB step) · Each port has a digital input/output. · A built-in self-boot function automatically sets the coefficients and register values at initialization. Moreover, four kinds of boot data can be chosen by pin setup. Boot ROM: 1024 word × 18 bit · The DSP block specification are as follows: Data bus: 24 bit Multiplier/adder: 24 bit × 16 bit + 43 bit → 43 bit Accumulator: 43 bit (sign extension: 4 bit) Program ROM: 2048 word × 32 bit Coefficient RAM: 448 word × 16 bit Coefficient ROM: 256 word × 16 bit Offset RAM: 64 word × 16 bit Data RAM: 256 word × 24 bit Operation speed: 44 ns (510-step (approx.) operation per cycle at fs = 44.1 kHz) Interface buffer RAM: 32 word × 16 bit · Incorporates data delay RAM of 64 kbit. Delay RAM: 4096 word × 16 bit (64 kbit) · The microcontroller interface can be selected between TOSHIBA original 3 line type and I2C bus format. · CMOS silicon structure supports high speed. · The package is a 100-pin flat package. Weight: 1.57 g (typ.) |
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