AS5013 datasheet(5/50 Pages) AMSCO

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[v2-00] 2021-Apr-19

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AS5013 − Absolute Maximum Ratings

Stresses beyond those listed in Figure 5 may cause permanent

damage to the device. These are stress ratings only, and

functional operation of the device at these or any other

conditions beyond those indicated in Operating Conditions is

not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

Figure 5:

Absolute Maximum Ratings

Note(s):

1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”.The lead finish for

Pb-free leaded packages is matte tin (100% Sn).

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD

DC supply voltage

-0.3

VDDp

Peripheral supply

voltage

-0.3

VDD +0.3

Vin

Input pin voltage

-0.3

VDDp +0.3

-3.6

Iscr

Input current (latchup

immunity)

±100

JEDEC 78

Electrostatic Discharge

ESD

Electrostatic discharge

±2

MIL 883 E method 3015,

direct pad contact

ΘJA

Package thermal

resistance

-32

K/W

Velocity=0, Multi Layer PCB;

JEDEC Standard Testboard

Temperature Ranges and Storage Conditions

Tstrg

Storage temperature

-55

125

°C

Tbody

Package body

temperature

260

°C

IPC/JEDEC J-STD-020 (1)

RHNC

Humidity

non-condensing

585

MSL

Moisture Sensitive Level

Represents a maximum floor

life time of 168h

Absolute Maximum Ratings

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