6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

–0.3

6

V

Input voltage, all pins

(V–) – 0.3

(V+) + 0.3

V

Input current (INA+, INA–, INB+, INB–, INSA/B, OUTSA/B/1/2/3)

–10

10

mA

Output short-circuit(2)

Continuous Continuous

Operating temperature

–55

150

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply

voltage

Single-supply

2.2

5.5

V

Dual-supply

±1.1

±2.75

V

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA2328

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

165

°C/W

Junction-to-case (top) thermal resistance

53

°C/W

Junction-to-board thermal resistance

87

°C/W

Junction-to-top characterization parameter

4.9

°C/W

Junction-to-board characterization parameter

85

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA2328

SBOS957 – FEBRUARY 2022

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