11.2 Documentation Support

11.2.1 Related Documentation

The following documents are recommended as a reference for this device, and available for download at

www.ti.com:

• Texas Instruments, Software Pacemaker Detection Design Guide

• Texas Instruments, TIDA-00378 Schematic and Block Diagram

• Texas Instruments, PM2.5/PM10 Particle Sensor Analog Front-End for Air Quality Monitoring Design

• Texas Instruments, QFN/SON PCB Attachment

• Texas Instruments, Quad Flatpack No-Lead Logic Packages

• Texas Instruments, Compensate Transimpedance Amplifiers Intuitively

• Texas Instruments, Noise Analysis of FET Transimpedance Amplifiers

• Texas Instruments, Noise Analysis for High-Speed Op Amps

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

11.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

All trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

OPA2328

SBOS957 – FEBRUARY 2022

www.ti.com

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