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SIC401DB Datasheet(PDF) 16 Page - Vishay Siliconix

Part # SIC401DB
Description  15 A microBUCK® SiC401A/B Integrated Buck Regulator with Programmable LDO
PDF  30 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SIC401DB Datasheet(HTML) 16 Page - Vishay Siliconix

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SiC401A, SiC401BCD
www.vishay.com
Vishay Siliconix
S20-0483-Rev. E, 29-Jun-2020
16
Document Number: 63835
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 4 - Forced Continuous Mode Operation
Ultrasonic Power-Save Operation (SiC401A)
The SiC401A provides ultrasonic power-save operation at
light loads, with the minimum operating frequency fixed at
slightly under 25 kHz. This is accomplished by using an
internal timer that monitors the time between consecutive
high side gate pulses. If the time exceeds 40 μs, DL drives
high to turn the low side MOSFET on. This draws current
from VOUT through the inductor, forcing both VOUT and VFB
to fall. When VFB drops to the 600 mV threshold, the next DH
(the drive signal for the high side FET) on-time is triggered.
After the on-time is completed, the high side MOSFET is
turned off and the low side MOSFET turns on. The low side
MOSFET remains on until the inductor current ramps down
to zero, at which point the low side MOSFET is turned off.
Because the on-times are forced to occur at intervals no
greater than 40 μs, the frequency will not fall far below
25 kHz. Fig. 5 shows ultrasonic power-save operation.
Fig. 5 - Ultrasonic Power-Save Operation
Power-Save Operation (SiC401B)
The SiC401B provides power-save operation at light loads
with no minimum operating frequency. With power-save
enabled, the internal zero crossing comparator monitors the
inductor current via the voltage across the low side MOSFET
during the off-time. If the inductor current falls to zero for
eight consecutive switching cycles, the controller enters
MOSFET on each subsequent cycle provided that the
power-save operation. It will turn off the low side MOSFET
on each subsequent cycle provided that the current crosses
zero. At this time both MOSFETs remain off until VFB drops
to the 600 mV threshold. Because the MOSFETs are off, the
load is supplied by the output capacitor.
If the inductor current does not reach zero on any switching
cycle, the controller immediately exits power-save and
returns to forced continuous mode.
Fig. 6 shows power-save operation at light loads.
Fig. 6 - Power-Save Mode
Smart Power-Save Protection
Active loads may leak current from a higher voltage into the
switcher
output.
Under
light
load
conditions
with
power-save enabled, this can force VOUT to slowly rise and
reach the over voltage threshold, resulting in a hard
shut-down. Smart power-save prevents this condition.
When the FB voltage exceeds 10 % above nominal, the
device immediately disables power-save, and DL drives
high to turn on the low side MOSFET. This draws current
from VOUT through the inductor and causes VOUT to fall.
When VFB drops back to the 600 mV trip point, a normal tON
switching cycle begins. This method prevents a hard OVP
shut-down and also cycles energy from VOUT back to VIN. It
also minimizes operating power by avoiding forced
conduction mode operation. Fig. 7 shows typical waveforms
for the Smart Power Save feature.
FB ripple
voltage (VFB)
Inductor
current
DC load current
FB threshold
(600 mV)
DH
DL
On-time
(tON)
DH on-time is triggered when
VFB reaches the FB threshold
DL drives high when on-time is completed.
DL remains high until VFB falls to the FB threshold.
FB ripple
voltage (VFB)
Inductor
current
(0A)
FB threshold
(600 mV)
DH
DL
On-time
(tON)
DH on-time is triggered when
VFB reaches the FB threshold
After the 40 µs time-out, DL drives high if VFB
has not reached the FB threshold.
minimum fSW ~ 25 kHz
40 µs time-out



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