MIC23153

DS20006489B-page 6

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2021-2022 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10

seconds

Package Thermal Resistances

Thermal Resistance TDFN 2.5 mm x 2.5 mm

—

90

—

°C/W —

Thermal Resistance TDFN 2.5 mm x 2.5 mm

—

63

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

imum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.