DAC63202 datasheet(4/83 Pages) TI

4 / 83 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD

Supply voltage, VDD to AGND

–0.3

Digital inputs to AGND

–0.3

VDD + 0.3

CAP to AGND

–0.3

1.65

VFBX to AGND

–0.3

VDD + 0.3

VOUTX to AGND

–0.3

VDD + 0.3

VREF

External reference, VREF to AGND

–0.3

VDD + 0.3

Current into any pin except the OUTx pins

–10

Junction temperature

–40

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Positive supply voltage to ground (AGND)

1.7

5.5

VREF

External reference to ground (AGND)

1.7

VDD

VIH

Digital input high voltage, 1.7 V < VDD ≤ 5.5 V

1.62

VIL

Digital input low voltage

0.4

CCAP

External capacitor on CAP pin

0.5

μF

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

DACx3202

UNIT

RTE (WQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

24.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.1

°C/W

ΨJB

Junction-to-board characterization parameter

24.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

8.7

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

DAC53202, DAC63202

SLASF47 – MAY 2022

www.ti.com

Submit Document Feedback

Product Folder Links: DAC53202 DAC63202

DAC63202 Datasheet(PDF) 4 Page - Texas Instruments

DAC63202 Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83

Datasheet Download

Link URL