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DAC63202 Datasheet(PDF) 3 Page - Texas Instruments |
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DAC63202 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 83 page ![]() 5 Pin Configuration and Functions 1 FB0 12 FB1 2 OUT0 11 OUT1 3 NC 10 NC 4 NC 9 NC Not to scale Thermal Pad Figure 5-1. RTE (16-pin WQFN) Package, Top View Table 5-1. Pin Functions PIN TYPE DESCRIPTION NO. NAME 1 FB0 Input Voltage feedback pin for channel 0. In voltage-output mode, connect to OUT0 for closed-loop amplifier output. In current-output mode, keep the FB0 pin unconnected to minimize leakage current. 2 OUT0 Output Analog output voltage from DAC channel 0. 3 NC NC No connection. Leave the pin unconnected. 4 NC NC No connection. Leave the pin unconnected. 5 GPIO/SDO Input/Output General-purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO, and STATUS. For STATUS and SDO, connect the pin to the IO voltage with an external pullup resistor. If unused, connect the GPIO pin to VDD or AGND using an external resistor. This pin can ramp up before VDD. 6 SCL/SYNC Output I2C serial interface clock or SPI chip select input. This pin must be connected to the IO voltage using an external pullup resistor. This pin can ramp up before VDD. 7 A0/SDI Input Address configuration pin for I2C or serial data input for SPI. For A0, connect this pin to VDD, AGND, SDA, or SCL for address configuration (Section 7.5.2.2.1). For SDI, this pin does not need to be pulled up or pulled down. This pin can ramp up before VDD. 8 SDA/SCLK Input/Output Bidirectional I2C serial data bus or SPI clock input. This pin must be connected to the IO voltage using an external pullup resistor in I2C mode. This pin can ramp up before VDD. 9 NC NC No connection. Leave the pin unconnected. 10 NC NC No connection. Leave the pin unconnected. 11 OUT1 Output Analog output voltage from DAC channel 1. 12 FB1 Input Voltage feedback pin for channel 1. In voltage-output mode, connect to OUT1 for closed-loop amplifier output. In current-output mode, keep the FB1 pin unconnected to minimize leakage current. 13 CAP Power External bypass capacitor for the internal LDO. Connect a capacitor (approximately 1.5 μF) between CAP and AGND. 14 AGND Ground Ground reference point for all circuitry on the device. 15 VDD Power Supply voltage. 16 VREF Power External reference input. Connect a capacitor (approximately 0.1 μF) between VREF and AGND. Use a pullup resistor to VDD when the external reference is not used. This pin must not ramp up before VDD. In case an external reference is used, make sure the reference ramps up after VDD. Thermal pad Thermal Pad Ground Connect the thermal pad to AGND. www.ti.com DAC53202, DAC63202 SLASF47 – MAY 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: DAC53202 DAC63202 |
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