7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

13

V

Input voltage

V

Differential input voltage

V

Continuous input current

±10

mA

Continuous power dissipation

See Thermal Information

Maximum junction temperature

150

°C

Operating free-air temperature

–40

105

°C

Storage temperature

–65

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC

JS-002(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Total supply voltage

6

10

12.6

V

Ambient temperature

–40

25

105

°C

7.4 Thermal Information

THERMAL METRIC(1)

OPA817

UNIT

DTK (WSON)

8 PINS

Junction-to-ambient thermal resistance

64.9

°C/W

Junction-to-case (top) thermal resistance

53.0

°C/W

Junction-to-board thermal resistance

32.8

°C/W

Junction-to-top characterization parameter

1.3

°C/W

Junction-to-board characterization parameter

32.8

°C/W

Junction-to-case (bottom) thermal resistance

9.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA817

SBOS847 – JULY 2022

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