12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

• Texas Instruments, Wide Bandwidth Optical Front-end Reference Design

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Transimpedance Considerations for High-Speed Amplifiers application report

• Texas Instruments, Maximizing the Dynamic Range of Analog TIA Front-End techincal brief

• Texas Instruments, What You Need To Know About Transimpedance Amplifiers – Part 1

• Texas Instruments, What You Need To Know About Transimpedance Amplifiers – Part 2

• Texas Instruments, Training Video: How to Design Transimpedance Amplifier Circuits

• Texas Instruments, Training Video: High-Speed Transimpedance Amplifier Design Flow

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

12.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.5 Trademarks

All trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

12.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

OPA817

SBOS847 – JULY 2022

www.ti.com

18

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