PCM1820 datasheet(32/44 Pages) TI

32 / 44 page

11 Layout

11.1 Layout Guidelines

Each system design and printed circuit board (PCB) layout is unique. The layout must be carefully reviewed in

the context of a specific PCB design. However, the following guidelines can optimize the device performance:

• Connect the thermal pad to ground. Use a via pattern to connect the device thermal pad, which is the area

directly under the device, to the ground planes. This connection helps dissipate heat from the device.

• The decoupling capacitors for the power supplies must be placed close to the device pins.

• Route the analog differential audio signals differentially on the PCB for better noise immunity. Avoid crossing

digital and analog signals to prevent undesirable crosstalk.

• The device internal voltage references must be filtered using external capacitors. Place the filter capacitors

near the VREF pin for optimal performance.

• Directly short the VREF external capacitor ground terminal to the AVSS pin without using any vias for this

connection trace.

• Use ground planes to provide the lowest impedance for power and signal current between the device and the

decoupling capacitors. Treat the area directly under the device as a central ground area for the device, and

all device grounds must be connected directly to that area.

11.2 Layout Example

Figure 11-1. Example Layout

PCM1820-Q1, PCM1821-Q1

SBASAH4A – APRIL 2022 – REVISED SEPTEMBER 2022

www.ti.com

Submit Document Feedback

Product Folder Links: PCM1820-Q1 PCM1821-Q1

PCM1820 Datasheet(PDF) 32 Page - Texas Instruments