NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4225900/A 06/2020

www.ti.com

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

RTE0020A

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

3.1

2.9

3.1

2.9

0.05

0.00

0.8 MAX

SEATING PLANE

C

(0.1)

SQ

1.4±0.1

1.5

1.5

8X 0.4625

16X

0.5

0.3

16X

0.3

0.2

12X 0.5

8X

0.225

0.125

0.1

C A B

0.05

C

4X (SQ 0.2)

TYP

PIN1 ID

(OPTIONAL)

PIN 1 INDEX AREA

1

4

5

6

9

10

11

14

15

16

19

20

21

PCM1820-Q1, PCM1821-Q1

SBASAH4A – APRIL 2022 – REVISED SEPTEMBER 2022

www.ti.com

34

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