http://www.njr.com/

NJM8020/NJM8021

- 2 -

Ver.1

■ PRODUCT NAME INFORMATION

■ ORDERING INFORMATION

PRODUCT

NAME

PACKAGE

RoHS

HALOGEN-

FREE

TERMINAL

FINISH

MARKING

WEIGHT

(mg)

MOQ

(pcs)

NJM8020F

SOT-23-5

Yes

Yes

Sn2Bi

A5Z

15

3000

NJM8020F3

SC-88A

Yes

Yes

Sn2Bi

2E

7.5

3000

NJM8021F

SOT-23-5

Yes

Yes

Sn2Bi

A5Y

15

3000

NJM8021F3

SC-88A

Yes

Yes

Sn2Bi

2D

7.5

3000

NJM8021KG1

DFN6-G1

Yes

Yes

Sn2Bi

8021

3.5

3000

■ ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

RATING

UNIT

Supply Voltage

V

+- V-

36

V

Input Voltage

(1)

VIN

V

- - 0.3 to V- + 36

V

Output Terminal Input Voltage

Vo

V

- - 0.3 to V+ + 0.3

V

Differential Input Voltage

VID

±36

V

Input Current

(2)

IIN

5

mA

Power Dissipation (Ta=25℃)

SOT-23-5

SC-88A

DFN6-G1 (ESON6-G1)

PD

2-Layer / 4-Layer

480

(4) / 650(5)

360

(4) / 490(5)

330

(6) / 1200(7)

mW

Junction Temperature

Tjmax

150

°C

Storage Temperature Range

Tstg

- 65 to 150

°C

(1) Input voltage is the voltage should be allowed to apply to the input terminal independent of the magnitude of V

+

The normal amplifier operation input voltage is within “Common Mode Input Voltage Range” specified in the Electrical characteristics.

(2) This input current only exists when the voltage at any of the input leads is driven negative. It is due to the collector-vase junction of the input PNP transistor

becoming forward-biased and thereby acting as input diode clamp. In addition to this diode action, there is NPN parasitic action on the IC chip. This transistor

action can cause the output voltages of the OP-Amps to go to the V

+ voltage level (or to ground for a large overdrive) for the time during which an input is

driven negative.

(3) Short-circuit can cause excessive heating and destructive dissipation. Values are typical.

(4) Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2-layer FR-4)

(5) Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2x 74.2mm

(6) Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2-layer FR-4, with Exposed Pad)

(7) Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4-layer FR-4, with Exposed Pad)

*For 4-layer: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5

NJM8020

F

(TE1)

Part Number

Package

Taping Form