6.4 ESD Ratings - ISO Specification

DEVICE

VALUE

UNIT

V(ESD) Electrostatic discharge

Contact discharge

ISO 10605, 150-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

V

ESD751-Q1

± 22000

ESD761-Q1

± 15000

ISO 10605, 330-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

Air-gap discharge

ISO 10605, 150-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

ISO 10605, 330-pF, 330-Ω, IO

ESD1LIN24-Q1

± 30000

ESD751-Q1

± 22000

ESD761-Q1

± 15000

6.5 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

-24

24

V

TA

Operating free-air temperature

-55

150

°C

6.6 Thermal Information

THERMAL METRIC(1)

ESD1LIN24-Q1

ESD751-Q1

ESD761-Q1

UNIT

DYF (SOD-323)

DYA (SOD-523)

DPY (X1SON)

2 PINS

2 PINS

2 PINS

RθJA

Junction-to-ambient thermal resistance

705.4

282.3

746.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

315

150.6

301.2

°C/W

RθJB

Junction-to-board thermal resistance

561.5

98.3

509.6

°C/W

ΨJT

Junction-to-top characterization parameter

145

9.6

81.8

°C/W

ΨJB

Junction-to-board characterization parameter

550.2

97.7

503.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

ESD1LIN24-Q1, ESD751-Q1, ESD761-Q1

SLVSGS4B – SEPTEMBER 2022 – REVISED NOVEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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