6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

DEVICE

MIN

MAX UNIT

Ppp

IEC 61000-4-5 Power (tp – 8/20 µs) at 25°C

ESD752

210

W

IEC 61000-4-5 Power (tp – 8/20 µs) at 25°C

ESD762

90

W

Ipp

IEC 61000-4-5 current (tp – 8/20 µs) at 25°C

ESD752

5.7

A

IEC 61000-4-5 current (tp – 8/20 µs) at 25°C

ESD762

2.5

A

TA

Operating free-air temperature

-55

150

°C

TJ

Junction temperature

-55

150

°C

Tstg

Storage temperature

-65

155

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings—JEDEC Specification

PARAMETER

TEST CONDITION

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

± 2500

V

Charged device model (CDM), per JEDEC specification JS-002 (2)

± 1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufactuuring with a standard ESD control proccess.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufactuuring with a standard ESD control proccess.

6.3 ESD Ratings—IEC Specification

over TA = 25°C (unless otherwise noted)

PARAMETER

TEST CONDITION

DEVICE

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

ESD752

±30000

V

ESD762

±20000

V

IEC 61000-4-2 Air Discharge, all pins

ESD752

±30000

V

ESD762

±20000

V

6.4 Recommended Operating Conditions

PARAMETER

MIN

NOM

MAX

UNIT

VIN

Input voltage

-24

24

V

TA

Operating free-air temperature

-55

150

°C

6.5 Thermal Information

THERMAL METRIC(1)

ESD752

ESD762

UNIT

DBZ (SOT-23)

DCK (SOT-323 / SC-70)

DBZ (SOT-23)

3 PINS

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

291.5

283.0

325.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

147.1

164.1

178.8

°C/W

RθJB

Junction-to-board thermal resistance

131.1

105.1

165.5

°C/W

ΨJT

Junction-to-top characterization parameter

32.0

67.1

52.4

°C/W

ΨJB

Junction-to-board characterization parameter

130.2

104.4

164.4

°C/W

ESD752, ESD762

SLVSGX0B – MAY 2022 – REVISED NOVEMBER 2022

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