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OPA656 Datasheet(PDF) 21 Page - Texas Instruments |
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OPA656 Datasheet(HTML) 21 Page - Texas Instruments |
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21 / 30 page ![]() 11.2 Layout Example Place gain and feedback resistors close to pins to minimize stray capacitance Place bypass capacitor close to power pins Connect the thermal pad to a heat spreading plane, generally ground 1 8 2 7 3 6 4 5 CBYP RF RG RS CBYP Thermal Pad Connect PD to VS+ to enable the amplifier Ground and power plane removed from inner layers. Ground fill on outer layers also removed. Ground and power plane exist on inner layers. CBYP RF RG + ± VS± CBYP VS+ Representative schematic RS To Load No Connect Figure 11-1. Layout Recommendation www.ti.com OPA817 SBOS847A – JULY 2022 – REVISED DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: OPA817 |
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