5 Device Comparison Table

DEVICE

Supply Voltage (V)

BW (MHz)

Input

SLEW RATE (V/μs)

VOLTAGE NOISE (nV/√Hz)

MINIMUM STABLE

GAIN (V/V)

OPA817

±6.3

400

FET

1000

4.5

1

OPA818

±6.5

2700

FET

1400

2.2

7

OPA657

±5

1600

FET

700

4.8

7

OPA656

±5

230

FET

290

7

1

OPA659

±6

350

FET

2550

8.9

1

OPA858

±2.5

5500

CMOS

2000

2.5

7

THS4631

±15

210

FET

1000

7

1

6 Pin Configuration and Functions

1

2

3

4

8

7

6

5

+

PD

FB

IN

IN+

VS+

VS

NC

OUT

Not to scale

NC - no internal connection

Figure 6-1. DTK Package, 8-Pin WSON With Thermal Pad (Top View)

Table 6-1. Pin Functions

PIN

TYPE(1)

DESCRIPTION

NAME

NO.

FB

2

O

Feedback resistor connection (optional)

IN–

3

I

Inverting input

IN+

4

I

Noninverting input

NC

6

—

No connect (no internal connection to die)

OUT

7

O

Output of amplifier

PD

1

I

Power down (low = amplifier enabled, high = amplifier disabled); internal 2-MΩ pull-up allows floating

this pin

VS–

5

P

Negative power supply

VS+

8

P

Positive power supply

Thermal pad

—

Electrically isolated from the die substrate. The thermal pad can be connected to any potential

between the device power-supplies, but it is recommended to connect it to a heat-spreading plane,

typically ground.

(1)

I = input, O = output, P = power

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OPA817

SBOS847A – JULY 2022 – REVISED DECEMBER 2022

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