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EM6821 Datasheet(PDF) 68 Page - EM Microelectronic - MARIN SA |
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EM6821 Datasheet(HTML) 68 Page - EM Microelectronic - MARIN SA |
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68 / 68 page ![]() R EM6821 Copyright © 2005, EM Microelectronic-Marin SA 68 www.emmicroelectronic.com 23. Ordering Information 23.1 Packaged devices Ordering Part Number Part Number Package Delivery Form EM6821TQ52B-%%% TQFP 52 EIA Real (Tape) EM6821TQ52D-%%% TQFP 52 Trays (Plate) Package Marking The package marking on TQFP 52 is 3 lines of 11 digits each: First line: E M 6 8 2 1 % % % where %%% is the customer-specific number given by EM Second line: Lot number & code date assigned at production Third line: 11 digits chosen by customer (enter below) Customer specific package marking on third line: 11 digits are available for the TQFP52 Please specify below the desired customer marking. 23.2 DIE Form Ordering Part Number (selected examples) Part Number DIE Form Thickness EM6821WS11-%%% Sawn Wafer 11 mils EM6821WT27-%%% Sticky Tape 27 mils Please contact EM headquarters or your local EM office for any other detail. Also refer to page 59 for additional ordering information. EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for use as components in life support devices or systems. © EM Microelectronic-Marin SA, 03/05, Rev. B EM6821 - Package: Customer Version: TQ52 = TQFP 52 pin customer-specific number given by EM Microelectronic Delivery Form: B = EIA Real (Tape) D = Trays (Plate) TQ52 B %%% EM6821 - Die form: Customer Version: WW = Wafer customer-specific number given by EM Microelectronic WS = Sawn Wafer/Frame WP = Waffle Pack Thickness: WT = Sticky Tape 08 = 8 mils (203um) 11 = 11 mils (280um), by default 15 = 15 mils (380um) 21 = 21 mils (533um) 27 = 27 mils (686um), not backlapped 11 WS %%% |
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