EL1503CS datasheet(11/16 Pages) RENESAS

11 / 16 page

EL1503

FN7038 Rev 0.00

Page 11 of 16

July 17, 2001

FIGURE 37. POWER DISSIPATION vs AMBIENT

TEMPERATURE for VARIOUS MOUNTED

JAs

FIGURE 38. POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 39. POWER DISSIPATION vs AMBIENT TEMPERATURE

Typical Performance Curves (Continued)

0100

0.5

AMBIENT TEMPERATURE (°C)

4.5

-40

-20

3.5

3.0

2.5

2.0

1.5

1.0

4.0

JA = 30°C/W

JA = 43°C/W

JA = 53°C/W

JA = 80°C/W

150

025

100

125

AMBIENT TEMPERATURE (°C)

3.0

0.5

1.0

1.5

2.0

2.5

2.703W

24-PIN LPP POWER DISSIPATION & THERMAL

RESISTANCE. USING JEDEC JESD51-7 HIGH

EFFECTIVE THERMAL CONDUCTIVITY (4-LAYER)

TEST BOARD, LPP EXPOSED DIEPAD SOLDERED TO

PCB PER JESD51-5

100

-40

-20

020

AMBIENT TEMPERATURE (°C)

2.5

3.5

0.5

1.5

47°C/W

16-PIN SO POWER DISSIPATION & THERMAL

RESISTANCE. USING ELANTEC EL1503CS

DEMOBOARD, 2”X2” (4-LAYER) DEMOBOARD WITH

HEATSINK VIA INTERNAL GROUND PHASE

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