6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VDD – VSS

Supply voltage

48

V

VDD

–0.5

48

V

VSS

–48

0.5

V

VSEL or VEN

Logic control input pin voltage (SELx)

–0.5

48

V

ISEL or IEN

Logic control input pin current (SELx)

–30

30

mA

VS or VD

Source or drain voltage (Sx, Dx)

VSS–0.5

VDD+0.5

V

IIK

Diode clamp current(3)

–30

30

mA

IS or ID (CONT)

Source or drain continuous current (Sx, Dx)

IDC + 10 %(4)

mA

TA

Ambient temperature

–55

150

°C

Tstg

Storage temperature

–65

150

°C

TJ

Junction temperature

150

°C

(1)

Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If

used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional,

and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.

(4)

Refer to Source or Drain Continuous Current table for IDC specifications.

6.2 ESD Ratings

VALUE

UNIT

TMUX722x

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TMUX7221, TMUX7222

SCDS444 – FEBRUARY 2023

www.ti.com

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