601 Hardware Specifications, Rev 3

21

Preliminary/Subject to Change without Notice

Appendix A

General Handling Recommendations

The following list provides a few guidelines for package handling:

•

Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after

processing.

•

Do not apply any load to exceed 3 Kg after assembly.

•

Components should not be hot dip tinned

•

The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all

elevated temperature processes.

The package parameters are as follows:

Heat sink adhesive

AIEG-7655

IBM reference drawing

99F4869

Test socket

Yamaichi IC51-3044-1543-REV C

Signal

187

Power/ground

117

Total

304

A.1 Package Environmental, Operation, Shipment,

and Storage Requirements

The environmental, operation, shipment, and storage requirements are as follows:

•

Make sure that the package is suitable for continuous operation under business office environments.

— Operating environment: 10

°C to 40 °C, 8% to 80% relative humidity

— Storage environment: 1

°C to 60 °C, 5% to 80% relative humidity

— Shipping environment: 40

°C to 60 °C, 5% to 100% relative humidity

•

This component is qualified to meet JEDEC moisture Class 2

— After expiration of shelf life, packages may be baked at 120

°C (+10/–5 °C) for 4 hours

minimum and packaged.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com