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BF747 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BF747 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 11 page ![]() September 1995 3 Philips Semiconductors Product specification NPN 1 GHz wideband transistor BF747 THERMAL CHARACTERISTICS Note 1. Ts is the temperature at the soldering point of the collector pin. CHARACTERISTICS Tj =25 °C unless otherwise specified. Note 1. GUM is the maximum unilateral power gain, assuming S12 is zero and . SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point up to Ts =70 °C; note 1 260 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCB =10V −− 100 nA hFE DC current gain IC = 2 mA; VCE = 10 V 40 95 250 fT transition frequency IC = 15 mA; VCE = 10 V; f = 500 MHz 0.8 1.2 1.6 GHz Cre feedback capacitance IE =ie = 0; VCB =10V; f=1MHz − 0.5 − pF GUM maximum unilateral power gain; note 1 IC = 15 mA; VCE = 10 V; f = 100 MHz − 20 − dB G UM 10 log S 21 2 1S 11 2 – 1S 22 2 – -------------------------------------------------------------- dB = Fig.2 Power derating curve. handbook, halfpage 0 50 100 200 400 300 100 0 200 MBB401 150 Ts ( oC) Ptot (mW) VCE =10V. Fig.3 DC current gain as a function of collector current. handbook, halfpage 140 60 100 MBB397 20 hFE 1 10 1 10 2 10 I (mA) C |
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